Laminate: FR4
Board thickness: 1.6mm (.062-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 20um (0.8 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width
商品介紹
硬質PCB
Laminate: FR4
Board thickness: 1.6mm (.062-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 20um (0.8 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width
MC PCB
Material: Aluminum
Board thickness: 1.6mm (.062 inch)
Copper thickness: 35&mum (1oz) copper for all layers after finish
Copper wall in the hole: 0.8 mil
Solder resist: SMOBC bright White
Finish: Lead Free HAL
Trace width/width: 0.762/0.762mm (30/30 mil)
Minimum hole size:
商品介紹
MC PCB
Material: Aluminum
Board thickness: 1.6mm (.062 inch)
Copper thickness: 35&mum (1oz) copper for all layers after finish
Copper wall in the hole: 0.8 mil
Solder resist: SMOBC bright White
Finish: Lead Free HAL
Trace width/width: 0.762/0.762mm (30/30 mil)
Minimum hole size:
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